, Hong Kong
Photo by Kin Shing Lai on Unsplash.

Government issues $105.2b in infrastructure bond programme

Proceeds from the bonds were allocated or earmarked for projects in the Northern Metropolis.

The government has issued bonds totalling around $105.2b up to 31 March 2025 in its infrastructure bond programme.

The programme aims to leverage market capital to support infrastructure projects and to develop the bond market, the government said.

The proceeds from the bonds have been fully allocated or earmarked for projects in the Northern Metropolis, such as San Tin Technopole, including the Loop, Kwu Tung North/Fanling, Hung Shui Kiu/Ha Tsuen, and Yuen Long South, it added. 
 

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